To mount extremely small components accurately require accurate , stable product shape, designing substrate as well as high precision printing technology of cream solder and mounting technology. Carrier tape precision is also required.

In the interest of achieving higher voltage and reliability, resistive material itself needs improvement. The movement of Pb-free is required now not to use Pb-contained solder for electrode plating of resistors. In the future, every one of material such as resistor film, protective film and inner co 

The recent market requires higher density mounting, which leads to the request for higher power at conventional product size.  Resistors had been used with luxury of derating before while resistors are getting used with tight derating recently. We have to improve resistors themselves as well as to study the rated power of resistors, mounting method, recommended pattern layout, etc., to take necessary measures to these trends. In future, it is possible the derating curve of SMD resistors will be changed from ambient temperature to terminal part temperature. The downsizing of resistors is nearly the limit and in the coming years DES(Device Embedded Substrate) compounding EPD including resistors, capacitors and inductors or semiconductor EAD(Embedded Active Device) seems to become popular. To enable high speed transmission or processing, a conventional current as an electric signal has achieved integrating with optical signal and emerged as electric and optical circuit. DES including optical components seems also to be promoted.