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SEMICON Taiwan 2026 Kicks Off: AI Chips’ Bottleneck Is Wires Connecting Them

Writer：Microhm Page View：Date：2026-09-01

SEMICON Taiwan 2026 officially kicked off its forum program in Taipei on August 31, with the main exhibition scheduled for September 2–4 at Taipei Nangang Exhibition Center. As one of the semiconductor industry's major annual events, this year's discussions are shifting from simply asking “How fast can a chip be?” to a new challenge: Can the connections between chips keep up with the growing demand for computing?

With the rapid growth of AI, high-performance computing (HPC), and data centers, technologies including advanced packaging, HBM, heterogeneous integration, silicon photonics, and high-speed interconnects are becoming increasingly important. SEMI highlights that semiconductor competition is moving beyond individual chip performance toward system-level integration.

As AI continues to drive higher computing performance, improving packaging efficiency, data transmission, and material reliability will be critical to the next stage of semiconductor development.

SEMICON Taiwan 2026 Exhibition Booth & Badge

Microhm continues to follow developments in semiconductor materials and advanced packaging technologies, providing high-quality precision components and solutions to meet the evolving demands of next-generation electronic and semiconductor applications.

SEMICON Taiwan 2026 Kicks Off: AI Chips’ Bottleneck Is Wires Connecting Them

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